JPH0723963Y2 - 混成集積回路の封止容器用金型 - Google Patents

混成集積回路の封止容器用金型

Info

Publication number
JPH0723963Y2
JPH0723963Y2 JP1989030637U JP3063789U JPH0723963Y2 JP H0723963 Y2 JPH0723963 Y2 JP H0723963Y2 JP 1989030637 U JP1989030637 U JP 1989030637U JP 3063789 U JP3063789 U JP 3063789U JP H0723963 Y2 JPH0723963 Y2 JP H0723963Y2
Authority
JP
Japan
Prior art keywords
mold
integrated circuit
hybrid integrated
resin
sealing container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989030637U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02120841U (en]
Inventor
修 中本
高橋　　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1989030637U priority Critical patent/JPH0723963Y2/ja
Publication of JPH02120841U publication Critical patent/JPH02120841U/ja
Application granted granted Critical
Publication of JPH0723963Y2 publication Critical patent/JPH0723963Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989030637U 1989-03-16 1989-03-16 混成集積回路の封止容器用金型 Expired - Lifetime JPH0723963Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Publications (2)

Publication Number Publication Date
JPH02120841U JPH02120841U (en]) 1990-09-28
JPH0723963Y2 true JPH0723963Y2 (ja) 1995-05-31

Family

ID=31255873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030637U Expired - Lifetime JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Country Status (1)

Country Link
JP (1) JPH0723963Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224949A (ja) * 1986-03-27 1987-10-02 S M C:Kk Ｉｃパツケ−ジ
JPH0770637B2 (ja) * 1986-11-20 1995-07-31 三共化成株式会社 熱可塑性合成樹脂製回路板およびその製法

Also Published As

Publication number Publication date
JPH02120841U (en]) 1990-09-28

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